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Advanced Semiconductor Packaging: Paving the Way for Next-Generation Electronics
In the ever-evolving world of electronics, the demand for smaller, faster, and more efficient devices has led to significant advancements in semiconductor technology. Advanced Semiconductor Packaging (ASP) has emerged as a critical enabler in meeting these demands.
What Is Advanced Semiconductor Packaging?
Advanced Semiconductor Packaging refers to innovative techniques that integrate multiple semiconductor dies or components into a single package. These methods enhance performance, reduce form factor, and improve power efficiency. Technologies such as 2.5D and 3D packaging, flip-chip bonding, and fan-out wafer-level packaging are at the forefront of this evolution.Semiconductor Engineering+1Precedence Research+2IDTechEx+2
Rising Demand and Market Growth
The Advanced Semiconductor Packaging demand is experiencing a substantial increase, driven by the proliferation of high-performance computing applications, including artificial intelligence (AI), 5G communications, and the Internet of Things (IoT). These applications require chips that are not only powerful but also compact and energy-efficient, making advanced packaging solutions…
